Fabrication Process Integrity Monitoring and Insider Threat Detection: AI-Enhanced Cybersecurity for U.S. Semiconductor Manufacturing Infrastructure

Authors

  • Henrique Sentieiro Professor of Informatics, University of Coimbra

Keywords:

fabrication process integrity monitoring, insider threat detection, ai-enhanced cybersecurity, u.s. semiconductor manufacturing infrastructure, machine learning

Abstract

Sensors and built-in self-tests have become critical for successfully scaling beyond the 5-nanometer node. As such, U.S. semiconductor manufacturing is faced with vulnerable technology that offers adversaries opportunities to access sophisticated hidden backdoors. Enhanced cybersecurity solutions will aid our nation against cyberwars ranging from mere information collection to physical destruction of our power infrastructure.

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Published

31-12-2024

How to Cite

[1]
“Fabrication Process Integrity Monitoring and Insider Threat Detection: AI-Enhanced Cybersecurity for U.S. Semiconductor Manufacturing Infrastructure”, Human-Computer Interaction Persp., vol. 4, no. 2, pp. 11–25, Dec. 2024, Accessed: Jun. 04, 2026. [Online]. Available: https://thesciencebrigade.com/hcip/article/view/801